LSI package trend - LSI packages for high density packaging.

نویسندگان

چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

LRLW-LSI: An Improved Latent Semantic Indexing (LSI) Text Classifier

The task of Text Classification (TC) is to automatically assign natural language texts with thematic categories from a predefined category set. And Latent Semantic Indexing (LSI) is a well known technique in Information Retrieval, especially in dealing with polysemy (one word can have different meanings) and synonymy (different words are used to describe the same concept), but it is not an opti...

متن کامل

Silicon Photonics Optical Transceiver for High-speed, High-density and Low-power LSI Interconnect

The next-generation servers and supercomputers with high performance and low power consumption require not only CPUs with an enhanced processing capability, but also signal transmission technology that connects CPUs with other CPUs or memories at high density and low power. It is becoming difficult for electrical signal transmission to satisfy the demand for the next-generation servers and supe...

متن کامل

STICKS-A graphical compiler for high level LSI design

The need for good design automation in the area of integrated circuit layout is severe. It is believed that the STICKS system does much to fill that need. STICKS is a computer aided design system which frees the designer from the tedious aspects of IC design and allows him to concentrate on the more creative and necessarily human side of the design process. With STICKS the designer is allowed t...

متن کامل

Low Power Baseband Modem LSI

Mitsubishi Electric Corporation has developed a low power baseband modem LSI for W-CDMA mobile phones. The LSI was installed in D900i, achieving approx. 170/90 minutes of continuous talk time for voice/video phones, and approx. 550/420 hours of continuous standby time in stationary/moving states respectively. The architecture of this LSI is similar to that of the baseband modem LSI chipset used...

متن کامل

High-Performance FCBGA Based on Ultra-Thin Packaging Substrate

We developed a high-performance Flip-Chip Ball Grid Array (FCBGA) based on an ultra-thin, high-density packaging substrate called a Multi-Layer Thin Substrate (MLTS) in order to meet the high demand for high-density, high-performance, and low-cost LSI packages. The most important feature of the package is that it has a high-density, high-performance MLTS formed by removing a metal plate after m...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: HYBRIDS

سال: 1986

ISSN: 1884-1171,0914-2568

DOI: 10.5104/jiep1985.2.2